Electronics Packaging Power Delivery Technology Lead 

Jun 09, 2024
Austin, United States
... Not specified
... Intermediate
Full time
... Office work


WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_




 

THE ROLE:

In this role you will lead the development of next generation electronics packaging power delivery technologies.

 

THE PERSON:

The ideal candidate will be highly organized and present well to executive teams. Self motivated and able to work independently.

 

 

RESPONSIBILITIES:

  • Lead development of power delivery-related packaging technologies including next-generation capacitors, inductors, and active components sourced from established and emerging suppliers. Maintain a roadmap of development efforts across time and product families.
  • Lead the design, fabrication, and measurement of test vehicles to demonstrate the viability of these technologies for deployment on high-volume products.
  • Organize the evaluation of thermal, mechanical, and reliability performance of these technologies to ensure broad compatibility with AMD packaging architectures.
  • Partner with labs to develop passive and active measurement techniques to evaluate the electrical performance of these components and deploy standard measurement techniques to suppliers and academic institutions. Design PCBs, fixtures, etc. to assist with measurement standardization across multiple labs.
  • Manage supplier technical interactions for components.
  • Maintain a database of qualified components and components under evaluation.
  • Partner with substrates, suppliers, and reliability engineers to drive continuous improvement in current carrying capability of packaging.
  • Manage academic research partnerships in the area of power delivery technologies and components.

PREFERRED EXPERIENCE :

- Direct experience with power integrity analysis, including 2.5D & 3D electro-magnetic simulations. 

- Direct experience with measurement techniques for power delivery components

- Familiarity with electronics packaging including substrates, power delivery passives, and advanced packaging.

- Knowledge of power delivery circuits including linear and buck regulators.

 

EDUCATION:

MS or PHD in related engineering field

 

LOCATION:  Austin, TX

 

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At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

 

THE ROLE:

In this role you will lead the development of next generation electronics packaging power delivery technologies.

 

THE PERSON:

The ideal candidate will be highly organized and present well to executive teams. Self motivated and able to work independently.

 

 

RESPONSIBILITIES:

  • Lead development of power delivery-related packaging technologies including next-generation capacitors, inductors, and active components sourced from established and emerging suppliers. Maintain a roadmap of development efforts across time and product families.
  • Lead the design, fabrication, and measurement of test vehicles to demonstrate the viability of these technologies for deployment on high-volume products.
  • Organize the evaluation of thermal, mechanical, and reliability performance of these technologies to ensure broad compatibility with AMD packaging architectures.
  • Partner with labs to develop passive and active measurement techniques to evaluate the electrical performance of these components and deploy standard measurement techniques to suppliers and academic institutions. Design PCBs, fixtures, etc. to assist with measurement standardization across multiple labs.
  • Manage supplier technical interactions for components.
  • Maintain a database of qualified components and components under evaluation.
  • Partner with substrates, suppliers, and reliability engineers to drive continuous improvement in current carrying capability of packaging.
  • Manage academic research partnerships in the area of power delivery technologies and components.

PREFERRED EXPERIENCE :

- Direct experience with power integrity analysis, including 2.5D & 3D electro-magnetic simulations. 

- Direct experience with measurement techniques for power delivery components

- Familiarity with electronics packaging including substrates, power delivery passives, and advanced packaging.

- Knowledge of power delivery circuits including linear and buck regulators.

 

EDUCATION:

MS or PHD in related engineering field

 

LOCATION:  Austin, TX

 

#LI-HYBRID

#LI-AP3

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