Fellow Thermal Mechanical Architect , Data Center GPU and Accelerated Processing

Mar 07, 2024
Austin, United States
... Not specified
... Intermediate
Full time
... Office work


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Senior Thermal Mechanical Engineer, Data Center GPU and Accelerated Processing

 

THE ROLE:

As a  Member of the Data Center and GPU Accelerated Processing (DCGAP) Thermal Mechanical Engineering department, you will be responsible for the thermal architecture, mechanical design, and technology development for the AMD Data Center GPUs products in this expanding and strategic market for AMD.  In addition, you will also drive the thermal design of these products at a chip module, card, and system-level.  To accomplish this, you will need to interact with other key engineering teams such as silicon design, boarding engineering, validation, and manufacturing and leaders within AMD, our customers, and our partners.

 

THE PERSON:

The Thermal Systems Architect in the Thermal Mechanical Engineering team will have excellent communication skills, planning skills, technical expertise, broad technical leadership skills, and critical problem-solving skills. They will be market savvy and comfortable in a fast paced, multi-tasking environment.

 

KEY RESPONSIBILITIES:

The Thermal Architect in the Thermal Mechanical Engineering team will be responsible for assisting in the technical leadership of a small, but highly focused global engineering team based in Austin, Texas.  The successful candidate will have a thermal/mechanical development background focusing on the integration of silicon devices into products and work as part of a global team in delivering commercially viable products to the marketplace in a timely and cost-effective manner.

 

You will manage work assignments and coordinate results with a cross functional team, as well as developing key relationships with OEM/ODM customers.  The position includes focusing on the technology development and productization of thermal architecture, packaging technologies, production control, and system-level technologies for AMD’s products.   

 

Specific pre-silicon work would include activities such as thermal feature/architecture definition and design, package technology development, thermal modeling, and system development for specific AMD markets.  Specific post-silicon work includes test planning and creation, characterization, data analysis, and customer/reference system design and characterization.  This role requires considerable use of initiative and independent judgment.

 

The selected candidate will have the ability to ‘influence’ and effectively communicate their vision throughout the organization. They will be a driver of continuous improvement and new ways of thinking by promoting new ideas/perspectives around thermal design, architectures, and product definition.

 

The following defines successful performance criteria for the position:

  • Commercialization– You will bring together hardware, software, product development and manufacturing activities to deliver commercially-viable products/platforms to the marketplace in a timely and cost-effective manner.  The position will drive engineering work that spans abroad timeline from innovative technology development to productization.
  • Technology Roadmap/ Product Development Plan– The role will be expected to review, summarize, and regularly update the technology roadmap and product development execution plan for the team
  • Continuous Improvement– The role will be expected to constantly drive process improvements while executing fast time-to-market on products.  Key metrics will show progress and enable the setting of targets.  Performance metrics and process improvements will be utilized to drive continuous improvements

 

PREFERRED EXPERIENCE:

The Thermal Architect of the Thermal Mechanical Engineering team must have demonstrated the ability to be a constant force for innovation and improvement throughout their career. The successful candidate must have experience leading senior-level engineers and will play a pivotal role in empowering and strengthening the core values of this team. Our selected candidate will use his/her proven leadership and architecture skills to ensure the engineering team continuously innovates, uses ‘best practices’ and adds value for its customers.

 

Critical Experiences & Competencies for Success:

  • Technical Leadership Experience - At least ten (10+) years of technical subject matter leadership experience in a large, fast paced environment. Other experiences should include demonstrated accomplishments in growing, mentoring junior engineers, providing technical and career guidance, and ultimately building fully functional leadership teams. Project management of multiple technically diverse programs in parallel is required.
  • Technical Experience - Solid understanding of thermal design and thermal analysis. Semiconductor device physics knowledge is a plus. The selected candidates should understand and be proficient in the development of thermal/mechanical solutions at the silicon, package, and system-level for semi-conductor products; data analysis and characterization, optimization of packaging for increased quality and cost improvement of high-end semiconductor products such as microprocessors.  
  • Thermal Modelling - Working knowledge of statistical analysis, thermal analysis, computational fluid dynamics, and multiphase physics analysis. Icepak and Ansys experience a plus.
  • Strategic Thinking -   The decisions made by this position will have long term impact on the capability and competitiveness of the organization.  As a result, this person must be skilled at defining and implementing strategies in a dynamic, high-tech business environment that involves significant uncertainty, difficult competition, and potential for new entrants.
  • Teamwork - Effective collaboration with the entire company, operations, vendors, and external partners is particularly critical for success.  Leading by example and instilling effective teamwork throughout the organization is imperative. 

 

 

ACADEMIC CREDENTIALS:

BS 10+ yrs in Mechanical Engineering or applied physics is preferred.  Any speculation in related field is advantageous.   An advanced Engineering degree would be an added plus.

 

 

LOCATION:

Austin, Texas

 

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At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Senior Thermal Mechanical Engineer, Data Center GPU and Accelerated Processing

 

THE ROLE:

As a  Member of the Data Center and GPU Accelerated Processing (DCGAP) Thermal Mechanical Engineering department, you will be responsible for the thermal architecture, mechanical design, and technology development for the AMD Data Center GPUs products in this expanding and strategic market for AMD.  In addition, you will also drive the thermal design of these products at a chip module, card, and system-level.  To accomplish this, you will need to interact with other key engineering teams such as silicon design, boarding engineering, validation, and manufacturing and leaders within AMD, our customers, and our partners.

 

THE PERSON:

The Thermal Systems Architect in the Thermal Mechanical Engineering team will have excellent communication skills, planning skills, technical expertise, broad technical leadership skills, and critical problem-solving skills. They will be market savvy and comfortable in a fast paced, multi-tasking environment.

 

KEY RESPONSIBILITIES:

The Thermal Architect in the Thermal Mechanical Engineering team will be responsible for assisting in the technical leadership of a small, but highly focused global engineering team based in Austin, Texas.  The successful candidate will have a thermal/mechanical development background focusing on the integration of silicon devices into products and work as part of a global team in delivering commercially viable products to the marketplace in a timely and cost-effective manner.

 

You will manage work assignments and coordinate results with a cross functional team, as well as developing key relationships with OEM/ODM customers.  The position includes focusing on the technology development and productization of thermal architecture, packaging technologies, production control, and system-level technologies for AMD’s products.   

 

Specific pre-silicon work would include activities such as thermal feature/architecture definition and design, package technology development, thermal modeling, and system development for specific AMD markets.  Specific post-silicon work includes test planning and creation, characterization, data analysis, and customer/reference system design and characterization.  This role requires considerable use of initiative and independent judgment.

 

The selected candidate will have the ability to ‘influence’ and effectively communicate their vision throughout the organization. They will be a driver of continuous improvement and new ways of thinking by promoting new ideas/perspectives around thermal design, architectures, and product definition.

 

The following defines successful performance criteria for the position:

  • Commercialization– You will bring together hardware, software, product development and manufacturing activities to deliver commercially-viable products/platforms to the marketplace in a timely and cost-effective manner.  The position will drive engineering work that spans abroad timeline from innovative technology development to productization.
  • Technology Roadmap/ Product Development Plan– The role will be expected to review, summarize, and regularly update the technology roadmap and product development execution plan for the team
  • Continuous Improvement– The role will be expected to constantly drive process improvements while executing fast time-to-market on products.  Key metrics will show progress and enable the setting of targets.  Performance metrics and process improvements will be utilized to drive continuous improvements

 

PREFERRED EXPERIENCE:

The Thermal Architect of the Thermal Mechanical Engineering team must have demonstrated the ability to be a constant force for innovation and improvement throughout their career. The successful candidate must have experience leading senior-level engineers and will play a pivotal role in empowering and strengthening the core values of this team. Our selected candidate will use his/her proven leadership and architecture skills to ensure the engineering team continuously innovates, uses ‘best practices’ and adds value for its customers.

 

Critical Experiences & Competencies for Success:

  • Technical Leadership Experience - At least ten (10+) years of technical subject matter leadership experience in a large, fast paced environment. Other experiences should include demonstrated accomplishments in growing, mentoring junior engineers, providing technical and career guidance, and ultimately building fully functional leadership teams. Project management of multiple technically diverse programs in parallel is required.
  • Technical Experience - Solid understanding of thermal design and thermal analysis. Semiconductor device physics knowledge is a plus. The selected candidates should understand and be proficient in the development of thermal/mechanical solutions at the silicon, package, and system-level for semi-conductor products; data analysis and characterization, optimization of packaging for increased quality and cost improvement of high-end semiconductor products such as microprocessors.  
  • Thermal Modelling - Working knowledge of statistical analysis, thermal analysis, computational fluid dynamics, and multiphase physics analysis. Icepak and Ansys experience a plus.
  • Strategic Thinking -   The decisions made by this position will have long term impact on the capability and competitiveness of the organization.  As a result, this person must be skilled at defining and implementing strategies in a dynamic, high-tech business environment that involves significant uncertainty, difficult competition, and potential for new entrants.
  • Teamwork - Effective collaboration with the entire company, operations, vendors, and external partners is particularly critical for success.  Leading by example and instilling effective teamwork throughout the organization is imperative. 

 

 

ACADEMIC CREDENTIALS:

BS 10+ yrs in Mechanical Engineering or applied physics is preferred.  Any speculation in related field is advantageous.   An advanced Engineering degree would be an added plus.

 

 

LOCATION:

Austin, Texas

 

#LI-DKDAMD1

 

#LI-HYBRID

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