IC Package Design Director

Mar 30, 2024
San Jose, United States
... Not specified
... Senior
Full time
... Office work


WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_




THE ROLE:

We are seeking an exceptionally skilled and seasoned professional to spearhead the IC package design team within AMD’s Adaptive and Embedded Computing Group (AECG). In the role of IC Package Design Director, you will lead both the electrical and physical teams responsible for the design and advancement of sophisticated IC packages for our state-of-the-art semiconductor products. Your leadership will be pivotal in shaping the trajectory of AMD's product range, driving innovation, ensuring flawless design execution, and achieving ambitious time-to-market objectives.

 

THE PERSON:

 

We are seeking a skilled and seasoned professional who has the desire, drive and experience of leading a team of talented engineers. A person who is collaborative and communicative to work with global teams and mentor their own.

 

 

KEY RESPONSIBILITIES:

  • Manage package electrical and physical design teams to deliver new packages on schedule.  Oversee the design and verification methodology and flow for maximum efficiency and consistent quality. Work cross-functionally with silicon, PCB and SIPI teams to define design specs and negotiate interdependencies of NPI process. 
  • Drive advanced technology adoption into package design for performance as well as cost reduction.  Drive test vehicles development for next-gen silicon IP and portfolio. Support reliability based DFx design, implementations, and verifications.
  • Develop the team members for their high performance and career growth at AMD
  • Participate and support the pinmap, layout, model, simulation analysis for silicon product family planning

 

PREFERRED EXPERIENCE:

  • Possesses comprehensive knowledge of high-speed serdes, memory interface, supply voltage noise, and packaging technologies/trends to ensure thorough package design validation across all phases of the product cycle.
  • Proficient in navigating the intricacies of package development flow and adept at collaborating seamlessly with NPI program management and manufacturing/process teams to formulate a cohesive package introduction plan.
  • Skilled in interfacing and negotiating effectively across engineering teams to strike a balance between performance adequacy and schedule commitments.
  • Capable of driving package design reviews, overseeing modeling/simulation projects, and delivering final design reviews (FDR) to all product stakeholders.
  • Collaborative mindset, working closely with silicon IP, silicon evaluation, and package technology teams to establish development plans and timelines for R&D projects, test vehicles, and prototype packages.
  • Extensive industry experience in IC package technology and product development within the semiconductor industry, with a consistent track record of success.
  • Demonstrated technical leadership in navigating complex product development challenges under demanding technical and schedule constraints

 

ACADEMIC CREDENTIALS:

  • Bachelor’s or Master's degree in Electrical Engineering, Computer Engineering, or a related field.

 

 

LOCATION: San Jose, CA

 

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At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE:

We are seeking an exceptionally skilled and seasoned professional to spearhead the IC package design team within AMD’s Adaptive and Embedded Computing Group (AECG). In the role of IC Package Design Director, you will lead both the electrical and physical teams responsible for the design and advancement of sophisticated IC packages for our state-of-the-art semiconductor products. Your leadership will be pivotal in shaping the trajectory of AMD's product range, driving innovation, ensuring flawless design execution, and achieving ambitious time-to-market objectives.

 

THE PERSON:

 

We are seeking a skilled and seasoned professional who has the desire, drive and experience of leading a team of talented engineers. A person who is collaborative and communicative to work with global teams and mentor their own.

 

 

KEY RESPONSIBILITIES:

  • Manage package electrical and physical design teams to deliver new packages on schedule.  Oversee the design and verification methodology and flow for maximum efficiency and consistent quality. Work cross-functionally with silicon, PCB and SIPI teams to define design specs and negotiate interdependencies of NPI process. 
  • Drive advanced technology adoption into package design for performance as well as cost reduction.  Drive test vehicles development for next-gen silicon IP and portfolio. Support reliability based DFx design, implementations, and verifications.
  • Develop the team members for their high performance and career growth at AMD
  • Participate and support the pinmap, layout, model, simulation analysis for silicon product family planning

 

PREFERRED EXPERIENCE:

  • Possesses comprehensive knowledge of high-speed serdes, memory interface, supply voltage noise, and packaging technologies/trends to ensure thorough package design validation across all phases of the product cycle.
  • Proficient in navigating the intricacies of package development flow and adept at collaborating seamlessly with NPI program management and manufacturing/process teams to formulate a cohesive package introduction plan.
  • Skilled in interfacing and negotiating effectively across engineering teams to strike a balance between performance adequacy and schedule commitments.
  • Capable of driving package design reviews, overseeing modeling/simulation projects, and delivering final design reviews (FDR) to all product stakeholders.
  • Collaborative mindset, working closely with silicon IP, silicon evaluation, and package technology teams to establish development plans and timelines for R&D projects, test vehicles, and prototype packages.
  • Extensive industry experience in IC package technology and product development within the semiconductor industry, with a consistent track record of success.
  • Demonstrated technical leadership in navigating complex product development challenges under demanding technical and schedule constraints

 

ACADEMIC CREDENTIALS:

  • Bachelor’s or Master's degree in Electrical Engineering, Computer Engineering, or a related field.

 

 

LOCATION: San Jose, CA

 

#LI-DW1

#LI-HYBRID

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