WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. This is who we are at our best. One Company. One Team. 

AMD together we advance_

The Role
As part of AMD's Package Engineering team, you will lead end to end new product development from concept to high-volume manufacturing. You will define packaging technology to support challenging product performance requirements, including BOM, signal integrity, thermo-mechanical, quality, cost, yield and reliability

The Person

·        Experienced at leading products from the conceptual phase to high-volume production, including package definition, package design, bump/assembly development, substrate definition/manufacturing, qualification and yield improvement in package development integration role for high complexity packages.

·        High aptitude for packaging development, including package design, chiplet integration, bumping/CPI, package, substrate and assembly.

·        Good knowledge of SI/PI and high speed interfaces (DDR, GDDR, PCIE, USB) and Package design (package layout, architecture, design rules, ballout/pin out development)

·        Proven track record of bringing products from Technology development, package design/definition, qualification, NPI through HVM is required.

·        Strong understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate with various package technology is required.

·        In depth knowledge of package reliability (1st & 2nd level interconnect) requirements, manufacturability, failure analysis and thermal/mechanical stress interactions is preferred.

·        Interact directly with OSAT/bumping/assembly/substrate suppliers/partners, Business units and customers.

Key Responsibilities:

·        Key customer interface for Packaging development.

·        Lead Package development for complex products (large FCBGA, MCM, SCM, chiplet, 2.5D, etc) working with cross functional teams (SOC, Platform, Quality/Reliability, SI/PI, Package design, etc) for product enablement.

·        Define package technology from conceptual phase with tradeoffs between cost, quality, reliability, performance and manufacturability.

·        Lead and drive projects with OSATs and suppliers on assembly, bumping, package integration, substrate design/manufacturing, materials development, etc

·        Lead Package development & NPI including pre/post silicon bringup, qualification, yield improvement, etc 

Preferred Experience:

·        End to end IC package development integration experience

·        Prior hands on package development experience on complex packages (FCBGA, SCM, MCM, 2.5D/3D, WLFO, etc)

·        Strong focus on flip chip, bumping/CPI, substrate, assembly, single chip, MCM, 2.5D/3D, packaging/substrate materials, chiplet technology (Fanout, InFO, CoWoS, FO-MCM, FoCoS, etc) and thin packaging.

·        Good working knowledge of SI/PI, Package Design/layout & chiplet technologies.

·        Good understanding of cross functional packaging areas including backend/assembly process technologies, 1st & 2nd level interconnect reliability, SI/PI, package design, thermal & mechanical.

Academic Credentials:

·        BS/MS/PhD in Mechanical, Electrical, Materials Science, Chemical Engineering or other relevant disciplines.

Location: Austin, TX

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At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

The Role
As part of AMD's Package Engineering team, you will lead end to end new product development from concept to high-volume manufacturing. You will define packaging technology to support challenging product performance requirements, including BOM, signal integrity, thermo-mechanical, quality, cost, yield and reliability

The Person

·        Experienced at leading products from the conceptual phase to high-volume production, including package definition, package design, bump/assembly development, substrate definition/manufacturing, qualification and yield improvement in package development integration role for high complexity packages.

·        High aptitude for packaging development, including package design, chiplet integration, bumping/CPI, package, substrate and assembly.

·        Good knowledge of SI/PI and high speed interfaces (DDR, GDDR, PCIE, USB) and Package design (package layout, architecture, design rules, ballout/pin out development)

·        Proven track record of bringing products from Technology development, package design/definition, qualification, NPI through HVM is required.

·        Strong understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate with various package technology is required.

·        In depth knowledge of package reliability (1st & 2nd level interconnect) requirements, manufacturability, failure analysis and thermal/mechanical stress interactions is preferred.

·        Interact directly with OSAT/bumping/assembly/substrate suppliers/partners, Business units and customers.

Key Responsibilities:

·        Key customer interface for Packaging development.

·        Lead Package development for complex products (large FCBGA, MCM, SCM, chiplet, 2.5D, etc) working with cross functional teams (SOC, Platform, Quality/Reliability, SI/PI, Package design, etc) for product enablement.

·        Define package technology from conceptual phase with tradeoffs between cost, quality, reliability, performance and manufacturability.

·        Lead and drive projects with OSATs and suppliers on assembly, bumping, package integration, substrate design/manufacturing, materials development, etc

·        Lead Package development & NPI including pre/post silicon bringup, qualification, yield improvement, etc 

Preferred Experience:

·        End to end IC package development integration experience

·        Prior hands on package development experience on complex packages (FCBGA, SCM, MCM, 2.5D/3D, WLFO, etc)

·        Strong focus on flip chip, bumping/CPI, substrate, assembly, single chip, MCM, 2.5D/3D, packaging/substrate materials, chiplet technology (Fanout, InFO, CoWoS, FO-MCM, FoCoS, etc) and thin packaging.

·        Good working knowledge of SI/PI, Package Design/layout & chiplet technologies.

·        Good understanding of cross functional packaging areas including backend/assembly process technologies, 1st & 2nd level interconnect reliability, SI/PI, package design, thermal & mechanical.

Academic Credentials:

·        BS/MS/PhD in Mechanical, Electrical, Materials Science, Chemical Engineering or other relevant disciplines.

Location: Austin, TX

#LI-AP3

#LI-HYBRID