WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_

THE ROLE:

A key contributor  of the Adaptive and Embedded Computing Group (AECG) Thermal Mechanical Engineering department Design of thermo-mechanical trade-offs and implement designs effectively. Apply out-of-the-box thinking on problem-solving for mechanical issues. Create products using technical judgement in thermo-mechanical areas. Complete engineering tasks with minimal re-design, and develop mechanical design objectives and project schedules. Work across organizational boundaries to define thermo-mechanical requirements, solve complex problems, and drive programs to successful completion. Contribute to the definition of product features taking into account of mechanical, electrical, and thermal trade-offs. Responsible for reflecting customer needs and company goals in the thermo-mechanical design. Research, define, design, and test mechanical parts to implement new features; and provide accurate user of modeling techniques to perform thermal modeling to predict temperatures of critical components using Icepak. Create prototypes of the thermal parts and assemblies such as heat sinks, baffles, carriers, vapor chamber, heat pipes, and liquid cooling. Verify thermal and mechanical compliance per PCI-e, OCP, Telcordia, ETSI spec and criteria. Evaluate thermal data collected from engineering and manufacturing test to confirm product conformance to thermo-mechanical requirements, testing, and modeling. Provide tolerance analysis of high complexity and precision mechanical designs. Utilize in-depth knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing, fixture design, design of experiments, instrumentation, data acquisition and analysis, thermo-couple building and testing, air flow measurement and thermal measurement, and mechanical pressure measurement.

THE PERSON:

The successful applicant will collaborate with cross-functional teams in  Package and Si design,  and Reliability teams to develop innovative thermal solutions, Key qualifications include:

The candidate will have excellent communication skills, planning skills, technical expertise, is a team player, possesses critical problem solving and troubleshooting skills, is a self-starter, and is well organized.

Strong collaboration and partnership skills.

KEY RESPONSIBILITIES:

• Follow field edge-technology and implement it in new product developments especially for  HPC and AI thermal solutions, Thermal interfaces materials, Fan cooling, Liquid cooling
• Using CFD skills (Icepak, Flotherm) perform a numerical simulation modeling to predict product thermal profiles and defined cooling performances
• With professional CAD mechanical design skills to ensure product specs (PCI-e, OCP, Telcordia, ETSI

etc.) compliance thermally and mechanically seamless

• Experimental Techniques to characterize Air Cooling and Liquid cooling thermal solutions.
• Evaluate and characterize criteria features with cross-board engineering team
• Mentor group of junior engineers by providing design and performance reviews
• Perform a vendor-supplier management, and marketing/AE technical support
• Work in a dynamic and fast-paced product development environment
• Thermal validation of thermal-mechanical hardware at chip, card and system level
• Investigate novel thermal technologies and work with vendors to productize it
• Drive process improvements while executing fast time-to-market on products.

ACADEMIC CREDENTIALS:

Master’s degree or PhD’s degree or foreign equivalent in Mechanical Engineering or related field. 

LOCATION: San Jose, CA

At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE:

A key contributor  of the Adaptive and Embedded Computing Group (AECG) Thermal Mechanical Engineering department Design of thermo-mechanical trade-offs and implement designs effectively. Apply out-of-the-box thinking on problem-solving for mechanical issues. Create products using technical judgement in thermo-mechanical areas. Complete engineering tasks with minimal re-design, and develop mechanical design objectives and project schedules. Work across organizational boundaries to define thermo-mechanical requirements, solve complex problems, and drive programs to successful completion. Contribute to the definition of product features taking into account of mechanical, electrical, and thermal trade-offs. Responsible for reflecting customer needs and company goals in the thermo-mechanical design. Research, define, design, and test mechanical parts to implement new features; and provide accurate user of modeling techniques to perform thermal modeling to predict temperatures of critical components using Icepak. Create prototypes of the thermal parts and assemblies such as heat sinks, baffles, carriers, vapor chamber, heat pipes, and liquid cooling. Verify thermal and mechanical compliance per PCI-e, OCP, Telcordia, ETSI spec and criteria. Evaluate thermal data collected from engineering and manufacturing test to confirm product conformance to thermo-mechanical requirements, testing, and modeling. Provide tolerance analysis of high complexity and precision mechanical designs. Utilize in-depth knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing, fixture design, design of experiments, instrumentation, data acquisition and analysis, thermo-couple building and testing, air flow measurement and thermal measurement, and mechanical pressure measurement.

THE PERSON:

The successful applicant will collaborate with cross-functional teams in  Package and Si design,  and Reliability teams to develop innovative thermal solutions, Key qualifications include:

The candidate will have excellent communication skills, planning skills, technical expertise, is a team player, possesses critical problem solving and troubleshooting skills, is a self-starter, and is well organized.

Strong collaboration and partnership skills.

KEY RESPONSIBILITIES:

• Follow field edge-technology and implement it in new product developments especially for  HPC and AI thermal solutions, Thermal interfaces materials, Fan cooling, Liquid cooling
• Using CFD skills (Icepak, Flotherm) perform a numerical simulation modeling to predict product thermal profiles and defined cooling performances
• With professional CAD mechanical design skills to ensure product specs (PCI-e, OCP, Telcordia, ETSI

etc.) compliance thermally and mechanically seamless

• Experimental Techniques to characterize Air Cooling and Liquid cooling thermal solutions.
• Evaluate and characterize criteria features with cross-board engineering team
• Mentor group of junior engineers by providing design and performance reviews
• Perform a vendor-supplier management, and marketing/AE technical support
• Work in a dynamic and fast-paced product development environment
• Thermal validation of thermal-mechanical hardware at chip, card and system level
• Investigate novel thermal technologies and work with vendors to productize it
• Drive process improvements while executing fast time-to-market on products.

ACADEMIC CREDENTIALS:

Master’s degree or PhD’s degree or foreign equivalent in Mechanical Engineering or related field. 

LOCATION: San Jose, CA