Santa Clara, Cuba
Not specified
Internship
Office work
WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. This is who we are at our best. One Company. One Team.
AMD together we advance_
MTS PACKAGING ENGINEER
AMD, Inc., is hiring MTS Packaging Engineer to Perform engineering duties in planning and designing tools, engines, machines, and other mechanically functioning equipment. Identify, develop and productize cutting edge advanced packaging for AMD products. Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements. Select development partners to bring into AMD supply chain to invest and develop these concepts. Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept through NPI. Transfer the new product into a high yielding, cost- effective, high volume-manufacturing environment. Identify, develop, and improve cutting edge advanced electronic packaging for computer processors, chips, and other AMD products. Develop concepts for novel electronic packaging schemes to satisfy future AMD performance requirements imposed by high-speed interfaces. Define electronic packaging requirements such as SI/PI, bumping, assembly, substrate design rules, and thermal for new products. Perform package and board level reliability qualification testing. Document electronic packaging schemes and generate related intellectual property. Collaborate with AMDs architects and circuit design teams to understand product needs. Partner with Product teams and Manufacturing Engineering to demonstrate reliability/feasibility of new electronic packaging technologies and manage the technology life cycle from concept, prototype construction, through NPI. Transfer AMD products into high-yielding, cost-effective, high volume manufacturing environment.
Multiple openings. Qualified applicants click “APPLY NOW” button to apply online.
Degree required:
Master’s degree or foreign equivalent in computer engineering, electronics engineering, electrical and computer engineering, or related field.
Amount and type of experience required: Two (2) years of experience in the job offered or closely related engineering role.
Specific skills required:The following skills are required:
Position requires two (2) years of experience in the following skills/technologies:
• CAD tools;
• Product development cycles;
• CMOS and package foundry process engineering and development;
• CMOS and package foundry fabrication;
• Failure mode evaluation and analysis (FMEA);
• Thin films;
• Electrochemistry;
• Surface engineering and analysis; and
• Technical program management.
#LI-DP1
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
MTS PACKAGING ENGINEER
AMD, Inc., is hiring MTS Packaging Engineer to Perform engineering duties in planning and designing tools, engines, machines, and other mechanically functioning equipment. Identify, develop and productize cutting edge advanced packaging for AMD products. Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements. Select development partners to bring into AMD supply chain to invest and develop these concepts. Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept through NPI. Transfer the new product into a high yielding, cost- effective, high volume-manufacturing environment. Identify, develop, and improve cutting edge advanced electronic packaging for computer processors, chips, and other AMD products. Develop concepts for novel electronic packaging schemes to satisfy future AMD performance requirements imposed by high-speed interfaces. Define electronic packaging requirements such as SI/PI, bumping, assembly, substrate design rules, and thermal for new products. Perform package and board level reliability qualification testing. Document electronic packaging schemes and generate related intellectual property. Collaborate with AMDs architects and circuit design teams to understand product needs. Partner with Product teams and Manufacturing Engineering to demonstrate reliability/feasibility of new electronic packaging technologies and manage the technology life cycle from concept, prototype construction, through NPI. Transfer AMD products into high-yielding, cost-effective, high volume manufacturing environment.
Multiple openings. Qualified applicants click “APPLY NOW” button to apply online.
Degree required:
Master’s degree or foreign equivalent in computer engineering, electronics engineering, electrical and computer engineering, or related field.
Amount and type of experience required: Two (2) years of experience in the job offered or closely related engineering role.
Specific skills required:The following skills are required:
Position requires two (2) years of experience in the following skills/technologies:
• CAD tools;
• Product development cycles;
• CMOS and package foundry process engineering and development;
• CMOS and package foundry fabrication;
• Failure mode evaluation and analysis (FMEA);
• Thin films;
• Electrochemistry;
• Surface engineering and analysis; and
• Technical program management.
#LI-DP1
