Packaging Engineer 2

Apr 19, 2024
Hsinchu, Taiwan
... Not specified
... Intermediate
Full time
... Office work


WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

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THE ROLE: 

AMD-AECG Si-Tech team is looking for a dynamic, competent advanced packaging engineer to join us. As a part of AMD packaging R&D team, you will drive new technology development, collaborate with internal and external teams, and enable a concept to product. Si-Tech fosters and encourages continuous technical innovation as well as facilitate continuous career development.

  

THE PERSON:  

We are looking for a passionate, innovative, self-motivated, and conscientious individual with a background of advanced packaging. The candidate should have strong knowledge in packaging platforms (FO, 3D/2.5DIC, hybrid bond, optics…etc.), good communication skill to drive OSAT/fab, and ability to collaborate with different teams.

  

KEY RESPONSIBILITIES:  

  • Establish good relationship with foundry, OSAT, material supplier. Support package development activities as an integration engineer, including various research, DOE planning and execution, action item follow up, technology benchmarking and new material survey.
  • Drive DOEs for initial build, product/technology qualification and CIPs.
  • Support TV design communication, process feasibility discussion and design rule management.
  • Drive stress/warp simulation, product/TV reliability and failure analysis.
  • Compile TV check list, design integration document, KPI, FMEA, yield trend, POR


PREFERRED EXPERIENCE: 

  • 3+ years of experience in package development and process integration
  • Knowledge of adv. packaging manufacturing processes e.g. FO, PoP, TSV, 2.5D/3D. Experience with hybrid bonding and optics package is a plus.
  • Understanding of device reliability requirement (e.g. Jedec) and failure analysis method (e.g. EDS, TEM, FIB)
  • Experience with risk assessment, DOE planning and data analysis. Excellent problem solving & communication skills.
  • Understanding of SI/PI, thermal solution and engineering statistics is plus. Good to have design software experience.

  

ACADEMIC CREDENTIALS: 

  • BS, MS in Materials Science, Chemical, Electrical, Mechanical Engineering or similar field

#LI-SC1 




Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE: 

AMD-AECG Si-Tech team is looking for a dynamic, competent advanced packaging engineer to join us. As a part of AMD packaging R&D team, you will drive new technology development, collaborate with internal and external teams, and enable a concept to product. Si-Tech fosters and encourages continuous technical innovation as well as facilitate continuous career development.

  

THE PERSON:  

We are looking for a passionate, innovative, self-motivated, and conscientious individual with a background of advanced packaging. The candidate should have strong knowledge in packaging platforms (FO, 3D/2.5DIC, hybrid bond, optics…etc.), good communication skill to drive OSAT/fab, and ability to collaborate with different teams.

  

KEY RESPONSIBILITIES:  

  • Establish good relationship with foundry, OSAT, material supplier. Support package development activities as an integration engineer, including various research, DOE planning and execution, action item follow up, technology benchmarking and new material survey.
  • Drive DOEs for initial build, product/technology qualification and CIPs.
  • Support TV design communication, process feasibility discussion and design rule management.
  • Drive stress/warp simulation, product/TV reliability and failure analysis.
  • Compile TV check list, design integration document, KPI, FMEA, yield trend, POR


PREFERRED EXPERIENCE: 

  • 3+ years of experience in package development and process integration
  • Knowledge of adv. packaging manufacturing processes e.g. FO, PoP, TSV, 2.5D/3D. Experience with hybrid bonding and optics package is a plus.
  • Understanding of device reliability requirement (e.g. Jedec) and failure analysis method (e.g. EDS, TEM, FIB)
  • Experience with risk assessment, DOE planning and data analysis. Excellent problem solving & communication skills.
  • Understanding of SI/PI, thermal solution and engineering statistics is plus. Good to have design software experience.

  

ACADEMIC CREDENTIALS: 

  • BS, MS in Materials Science, Chemical, Electrical, Mechanical Engineering or similar field

#LI-SC1 

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