San Jose, Philippines
Not specified
Internship
Office work
WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. This is who we are at our best. One Company. One Team.
AMD together we advance_
THE ROLE:
We are looking for a candidate to join the packaging team and work together with the SerDes and photonics design engineers on product development involving co-package optics (CPO).
THE PERSON:
This person has excellent verbal and written communication skills. Is a great team player and a problem solver. Has a proven track record of working across organization boundaries and driving complex programs to successful completion through collaboration. Is thoughtful, efficient, disciplined and has a tenacious commitment to continuous improvement and relentless drive to win.
KEY RESPONSIBILITIES:
Package design with CPO, photonics IC (PIC) to fiber coupling scheme assessment and selection, and development/qualification of fiber termination and connection technology for a photinics package with high fiber count (large fiber arrays).
PREFERRED EXPERIENCE:
Process:
- 5 + years' experience in Optoelectronic package mechanical design, single mode multifiber alignment and attach, fiber termination and connectorization, strain relief and Flip Chip Assembly.
- Knowledge in Photonics package reliability is highly desired.
- Knowledge in advanced IC packaging technologies a plus
- Direct experience in CPO highly desirable
Vendor and Project Management: Work with 3rd party, foundry and OSAT to bring packaging solution from concept to HVM
CAD: 5 + year's with Creo Is required and it will be plus to have SolidWorks - Experience using photonics simulation tools (e.g., Lumerical) a plus
FEA: FEA experience using ANSYS is a plus
Industrial experience: 5 + Years' experience in process development and mechanical design of Silicon photonics packages or modules and productization
Manufacturing: Excellent knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing in Asia as well as North America.
Lab Skills: Experience with Design of Experiments, instrumentation, data acquisition and analysis, including uncertainty analysis. This includes: mechanical pressure measurement, mechanical warpage using Shadow Morrie’, DIC, FIB, SEM, TMA, DMA, MTS, X-ray, C-SAM, T-SAM
ACADEMIC CREDENTIALS (Please do not apply unless you have):
Ph.D. or M.S. in Physics, Electrical Engineering, Mechanical Engineering or related field AND 5+ years of (post college) work experience in an optoelectronics package design and/or process role
LOCATION: San Jose, CA
#LI-SH2
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
THE ROLE:
We are looking for a candidate to join the packaging team and work together with the SerDes and photonics design engineers on product development involving co-package optics (CPO).
THE PERSON:
This person has excellent verbal and written communication skills. Is a great team player and a problem solver. Has a proven track record of working across organization boundaries and driving complex programs to successful completion through collaboration. Is thoughtful, efficient, disciplined and has a tenacious commitment to continuous improvement and relentless drive to win.
KEY RESPONSIBILITIES:
Package design with CPO, photonics IC (PIC) to fiber coupling scheme assessment and selection, and development/qualification of fiber termination and connection technology for a photinics package with high fiber count (large fiber arrays).
PREFERRED EXPERIENCE:
Process:
- 5 + years' experience in Optoelectronic package mechanical design, single mode multifiber alignment and attach, fiber termination and connectorization, strain relief and Flip Chip Assembly.
- Knowledge in Photonics package reliability is highly desired.
- Knowledge in advanced IC packaging technologies a plus
- Direct experience in CPO highly desirable
Vendor and Project Management: Work with 3rd party, foundry and OSAT to bring packaging solution from concept to HVM
CAD: 5 + year's with Creo Is required and it will be plus to have SolidWorks - Experience using photonics simulation tools (e.g., Lumerical) a plus
FEA: FEA experience using ANSYS is a plus
Industrial experience: 5 + Years' experience in process development and mechanical design of Silicon photonics packages or modules and productization
Manufacturing: Excellent knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing in Asia as well as North America.
Lab Skills: Experience with Design of Experiments, instrumentation, data acquisition and analysis, including uncertainty analysis. This includes: mechanical pressure measurement, mechanical warpage using Shadow Morrie’, DIC, FIB, SEM, TMA, DMA, MTS, X-ray, C-SAM, T-SAM
ACADEMIC CREDENTIALS (Please do not apply unless you have):
Ph.D. or M.S. in Physics, Electrical Engineering, Mechanical Engineering or related field AND 5+ years of (post college) work experience in an optoelectronics package design and/or process role
LOCATION: San Jose, CA
#LI-SH2
