Program Manager

May 27, 2022
Austin, United States
... Not specified
... Senior
Full time
... Office work


What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

The Role

 

The AMD Packaging organization is looking for a passionate and driven individual to lead and manage business operations.  In this Packaging Program Manager role, you will be the overall business owner overseeing multiple packaging programs across all Business Units.  You will work across all Engineering and Business functions to meet both technical and financial objectives of the packaging programs.

 

You Will

  • As a Program Manager, you are responsible to support packaging organization to lead strategic long-term planning for successfully launching AMD’s product roadmaps. 
  • Use the principles of Product Lifecycle Management, to track progress to meet ISO audit requirements, as products are brought through the New Product Introduction (NPI) cycle.
  • Enable seamless packaging development for products through their lifecycle, from concept, to feasibility, to plan and into production.
  • Plan and manage both programs and projects that are directly tied to the packaging development, implementation or upgrade of technology or products.
  • Define processes to optimize packaging development program schedules and milestones, and track progress against POR (Plan of Record).
  • Influence and oversee budget plans, costing, forecasting, estimating, and tracking of program spend for a large and growing package development team.
  • Provide leadership for the Packaging BU teams and key interfaces when asked to estimate and 3-5 year forecasts for resource/hardware deliverables based on historical trends and meet AOP (Annual Operating Plan).
  • Drive timely execution of programs
  • Ability to bridge forecasted expenses & resources vs. actual, to describe reasons for expense gaps, communicate expectations to team members, obtain task effort estimates from engineers, and create/modify/track the quarterly program spend, to ensure forecast accuracy for Packaging Team.
  • Assist in generation and tracking of Purchase requests and POs (Purchase Orders) to track materials and services delivery by working with both internal contacts and external suppliers and vendors.
  • Requires thorough knowledge of business operations in order to perform non-repetitive, analytical program management assignments.

 

 

 

Minimum Requirements

  • Technical background with experience in Program Management or Product Development Programs, particularly within Packaging.
  • Support program reviews, product lifecycle management reviews, and forecast reviews for assigned areas
  • Good communication, problem-solving, collaboration, interpersonal, and quantitative skills
  • Proficiency in using standard project tools (MS Office, MS Project, MS Teams, MS SharePoint, etc.)
  • Comfortable working with and extracting value from large datasets
  • Strong influencing and communication skills to lead technical programs or projects within a highly matrixed and multi-cultural organization
  • Able to collaborate with others and be a leader within function
  • Have the aptitude to interface with global teams.
  • Flexibility and tolerance of ambiguity, able to work in an unstructured environment.
  • Ability to manage and execute complex analysis, draw insights, and work under pressure with tight timelines and moving targets.
  • Highly organized, detailed oriented, a self-starter with a strong sense of ownership, ability to multi-task in dynamic environment.
  • Ability to deal with ambiguity, complexity and working under pressure with tight timelines and moving targets
  • Highly organized, detailed oriented, a self-starter with a strong sense of ownership
  • Ability to manage multiple priorities in dynamic environment

Preferred Experience

  • Technical expertise in semiconductor packaging
  • Experience working within the semiconductor substrate field
  • Strong experience in supplier relationship management
  • Experience with complex projects in a global team environment.
  • PMP or formal Project Management certification.

 

Academic Credentials

  • BS/BA degree in Mechanical Engineering, Electrical Engineering, or Computer Engineering or similar scientific discipline, with 5+ years of experience.
  • 2+ years experience managing packaging projects or programs; especially with semiconductor Package Design, Semiconductor Packaging development or similar.

 

Location Austin, TX

#LI-SD1


Requisition Number: 165883 
Country: United States State: Texas City: Austin 
Job Function: Other Engineering
  

Benefits offered are described here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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