SMTS Packaging Engineer
What you do at AMD changes everything
At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center.
Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
Job Description: Perform research and development activities in AMD’s advanced electronic packaging development team and manage cutting edge CPU IC package development program from concept development to high volume production. Research and develop substrate materials and manufacturing techniques, electronic packaging materials, assembly processes, multi-die stacking and 2.5D/3D package technologies. Solve technical issues on package reliability, materials, and assembly process. Solve technical issues on package reliability, materials, and assembly process. Work with FEA modeling engineers for stress analysis to optimize package construction and ideal material selection. Develop design guidelines and assembly process techniques for advanced electronic packaging. Create, conduct, and analyze Design of Experiments (DOE) for development and sustaining activities. Utilize hands-on expertise of assembly processes for flip chip package development. Perform package design and construction feasibility studies to define new package concepts based on available materials and product requirements. Develop novel schemes of packaging to enable new ways of packaging chis in such a way that performance is increased and cost is reduced. Collaborate with vendors on understanding emerging technologies related to electronic packaging.\
Amount and type of experience required:
Master’s degree in Materials Engineering, Materials Science or a related field of study. Foreign degree equivalent accepted.
Three (3) years of experience in the job offered or closely related engineering role.
With either combination of education and experience, position requires three (3) years of experience in Materials Engineering/ Packaging Technology; Metallurgy and Materials Science; Failure analysis; Solder Metallurgy; Flip chip packaging; Electroplating of Copper, Nickel, and Tin; Electroless Plating – Metallic Surface Finishes; and Program Management – Packaging technology.
Alternate Education and experience accepted:
Employer will accept alternate combination of education and experience: Bachelor's degree (or foreign equivalent) in Materials Engineering, Materials Science or a related field of study, and five (5) years of progressive, post-baccalaureate experience in the job offered or closely related engineering role.
Requisition Number: 171982
Country: United States State: Texas City: Austin
Job Function: Packaging Engineering
Benefits offered are described here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.