SMTS Packaging Engineer

Feb 16, 2024
Hsinchu, Taiwan
... Not specified
... Intermediate
Full time
... Office work


WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_




THE ROLE

As part of the AMD's Advanced Packaging team, you will drive technology development and the Supply Chain management of advanced 3D package architectures. The scope includes but not limited to: execute and coordinate proof of concept on new technology; product bring up and continue yield and reliability improvement to meet performance, cost, and schedule requirements to support new AMD products.

 

THE PERSON

The candidate should have a hands-on approach to new process development, strong organizational and communication skills to drive the 3D technology development and robust manufacturing bring up with internal partners as well as suppliers. Experience with Memory Stacking and HBM technology development is desired.

 

KEY RESPONSIBILITIES

  • Interface closely with AMD’s Foundry and development partners to lead and perform process optimization, yield and reliability improvement.
  • Interface closely with AMD’s Assembly and material partners, to develop and productize in bring up of new packaging technology from concept to NPI and prototyping to mass production phases with acceptable sustaining yields.
  • Drive/participate in defining FMEA, DFY, DOE, DFM, TV design, material selections, identifying critical process windows and material attributes, defining reliability tests including detection and FA methodology, and executing manufacturing characterization.

 

 

PREFERRED EXPERIENCE

  • Strong problem solving, communication, organizational, interpersonal, and presentation skills.
  • Good knowledge with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques.
  • Fundamental understanding and hand-on experience with HBM packaging process development is a plus.
  • Good knowledge in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR etc.
  • Familiarity with BEOL technologies and TSV integration.
  • Good track record of product implementations from new package technology development to qualification, prototype NPI, and HVM.
  • Knowledge of product risk assessment, mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, and manufacturing yield.

 

ACADEMIC CREDENTIALS

  • Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.

 

Location:  Hsinchu, Taiwan

 

#LI-SC1 




Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE

As part of the AMD's Advanced Packaging team, you will drive technology development and the Supply Chain management of advanced 3D package architectures. The scope includes but not limited to: execute and coordinate proof of concept on new technology; product bring up and continue yield and reliability improvement to meet performance, cost, and schedule requirements to support new AMD products.

 

THE PERSON

The candidate should have a hands-on approach to new process development, strong organizational and communication skills to drive the 3D technology development and robust manufacturing bring up with internal partners as well as suppliers. Experience with Memory Stacking and HBM technology development is desired.

 

KEY RESPONSIBILITIES

  • Interface closely with AMD’s Foundry and development partners to lead and perform process optimization, yield and reliability improvement.
  • Interface closely with AMD’s Assembly and material partners, to develop and productize in bring up of new packaging technology from concept to NPI and prototyping to mass production phases with acceptable sustaining yields.
  • Drive/participate in defining FMEA, DFY, DOE, DFM, TV design, material selections, identifying critical process windows and material attributes, defining reliability tests including detection and FA methodology, and executing manufacturing characterization.

 

 

PREFERRED EXPERIENCE

  • Strong problem solving, communication, organizational, interpersonal, and presentation skills.
  • Good knowledge with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques.
  • Fundamental understanding and hand-on experience with HBM packaging process development is a plus.
  • Good knowledge in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR etc.
  • Familiarity with BEOL technologies and TSV integration.
  • Good track record of product implementations from new package technology development to qualification, prototype NPI, and HVM.
  • Knowledge of product risk assessment, mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, and manufacturing yield.

 

ACADEMIC CREDENTIALS

  • Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.

 

Location:  Hsinchu, Taiwan

 

#LI-SC1 

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