Santa Clara, Cuba
Not specified
Internship
Office work
WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. This is who we are at our best. One Company. One Team.
AMD together we advance_
SMTS Packaging Engineer
AMD, Inc., is hiring SMTS Packaging Engineer to Research, design, develop, and/or test electronic components and systems for semiconductor and related device manufacturing, employing knowledge of electronic theory. Design a complete and complex framework, system or product. Define processes for technical platforms, system specifications, input/output and working parameters for hardware and/or software compatibility. Conceive system interfaces and business application prototypes. Identify, analyze and resolve system design weaknesses. Develop packaging technology to support performance in high-speed interfaces along with high thermo-mechanical, quality and reliability requirements, including bumping/CPI, package, substrate and assembly. Manage product from conceptual phase to high volume manufacturing on various aspects of packaging work with package and board level (system level) signal integrity (SI) simulation using multiple highspeed interfaces. Enhance package and board level performance with SI simulation tools, and integrate SI/PI guidelines and requirements. Define package technology from conceptual phase with tradeoffs between product electrical performance (SI/PI), cost quality, reliability and manufacturability. Work on package reliability (1st and 2nd level interconnect) requirements, manufacturability, failure analysis and thermal/mechanical stress interactions.
Multiple openings. Qualified applicants click “APPLY NOW” button to apply online.
Degree required:
Master’s degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science.
Amount and type of experience required: 3 years of experience in the job offered or a closely related engineering role.
Alternate combination of education and experience: Employer will alternatively accept a Bachelor’s degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science and 5 years of experience in the job offered or a closely related engineering role.
Or: Employer will alternatively accept a Ph.D. degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science.
Specific skills required: The following skills are required:
Master’s degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science and 3 years of experience in the job offered or a closely related engineering role. Position requires three (3) years of experience with the following technologies and/or skills: Assembly Package Development; FMEA; Reliability Failure Mechanism and Models; knowledge
of Materials; electrical, thermal, and mechanical characterization; and root cause analysis and issue resolution.
or
Employer will alternatively accept a Bachelor’s degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science and 5 years of experience in the job offered or a closely related engineering role. Position requires three (3) years of experience with the following technologies and/or skills: Assembly Package Development; FMEA; Reliability Failure Mechanism and Models; knowledge of Materials; electrical, thermal, and mechanical characterization; and root cause analysis and issue resolution.
or
Employer will alternatively accept a Ph.D. degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science. Position requires education or experience with the following technologies and/or skills: Assembly Package Development; FMEA; Reliability Failure Mechanism and Models; knowledge of Materials; electrical, thermal, and mechanical characterization; and root cause analysis and issue resolution. Employer will accept skills gained in furtherance of graduate-level degree via coursework, internships, research, projects, and/or theses.
Skills may be gained concurrently. Employer will accept any suitable combination of education, training, or experience.
#LI-DP1
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
SMTS Packaging Engineer
AMD, Inc., is hiring SMTS Packaging Engineer to Research, design, develop, and/or test electronic components and systems for semiconductor and related device manufacturing, employing knowledge of electronic theory. Design a complete and complex framework, system or product. Define processes for technical platforms, system specifications, input/output and working parameters for hardware and/or software compatibility. Conceive system interfaces and business application prototypes. Identify, analyze and resolve system design weaknesses. Develop packaging technology to support performance in high-speed interfaces along with high thermo-mechanical, quality and reliability requirements, including bumping/CPI, package, substrate and assembly. Manage product from conceptual phase to high volume manufacturing on various aspects of packaging work with package and board level (system level) signal integrity (SI) simulation using multiple highspeed interfaces. Enhance package and board level performance with SI simulation tools, and integrate SI/PI guidelines and requirements. Define package technology from conceptual phase with tradeoffs between product electrical performance (SI/PI), cost quality, reliability and manufacturability. Work on package reliability (1st and 2nd level interconnect) requirements, manufacturability, failure analysis and thermal/mechanical stress interactions.
Multiple openings. Qualified applicants click “APPLY NOW” button to apply online.
Degree required:
Master’s degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science.
Amount and type of experience required: 3 years of experience in the job offered or a closely related engineering role.
Alternate combination of education and experience: Employer will alternatively accept a Bachelor’s degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science and 5 years of experience in the job offered or a closely related engineering role.
Or: Employer will alternatively accept a Ph.D. degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science.
Specific skills required: The following skills are required:
Master’s degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science and 3 years of experience in the job offered or a closely related engineering role. Position requires three (3) years of experience with the following technologies and/or skills: Assembly Package Development; FMEA; Reliability Failure Mechanism and Models; knowledge
of Materials; electrical, thermal, and mechanical characterization; and root cause analysis and issue resolution.
or
Employer will alternatively accept a Bachelor’s degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science and 5 years of experience in the job offered or a closely related engineering role. Position requires three (3) years of experience with the following technologies and/or skills: Assembly Package Development; FMEA; Reliability Failure Mechanism and Models; knowledge of Materials; electrical, thermal, and mechanical characterization; and root cause analysis and issue resolution.
or
Employer will alternatively accept a Ph.D. degree or foreign equivalent in Industrial and Systems Engineering, Mechanical Engineering, Physics, Materials Engineering, or Materials Science. Position requires education or experience with the following technologies and/or skills: Assembly Package Development; FMEA; Reliability Failure Mechanism and Models; knowledge of Materials; electrical, thermal, and mechanical characterization; and root cause analysis and issue resolution. Employer will accept skills gained in furtherance of graduate-level degree via coursework, internships, research, projects, and/or theses.
Skills may be gained concurrently. Employer will accept any suitable combination of education, training, or experience.
#LI-DP1
