WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. This is who we are at our best. One Company. One Team. 

AMD together we advance_

THE ROLE
The Packaging Signal Integrity engineering team ensures that the performance and cost requirements of the product are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimization.

THE PERSON

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills.

KEY RESPONSIBILITIES

• Responsible for the electrical design, simulation and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector and board.
• Communicate effectively and work in close collaboration with others in AMD as well as with AMD’s customers to ensure optimal engineering design decisions and efficient problem solving.

PREFERRED EXPERIENCE

• Experience in SI/PI simulation and processing s-parameters
• Experience in high-speed digital signaling interfaces such as PCIE, DDR, GDDR6, HDMI and USB
• Experience in electrical modeling EDA tools such as HFSS, SIwave, ADS
• Experience in packaging, connector and board design for signal integrity and power integrity
• Knowledge in analog characterization, electromagnetic theory and digital circuit analysis
• Knowledge in packaging assembly and IC testing is a plus
• Ability to collaborate and work across different functional teams and different sites
• Self-driven and can work independently

ACADEMIC CREDENTIALS

• Master’s degree is preferred
• > 7 years relevant experience preferred

LOCATION:

Singapore

#LI-SP2

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE
The Packaging Signal Integrity engineering team ensures that the performance and cost requirements of the product are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimization.

THE PERSON

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills.

KEY RESPONSIBILITIES

• Responsible for the electrical design, simulation and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector and board.
• Communicate effectively and work in close collaboration with others in AMD as well as with AMD’s customers to ensure optimal engineering design decisions and efficient problem solving.

PREFERRED EXPERIENCE

• Experience in SI/PI simulation and processing s-parameters
• Experience in high-speed digital signaling interfaces such as PCIE, DDR, GDDR6, HDMI and USB
• Experience in electrical modeling EDA tools such as HFSS, SIwave, ADS
• Experience in packaging, connector and board design for signal integrity and power integrity
• Knowledge in analog characterization, electromagnetic theory and digital circuit analysis
• Knowledge in packaging assembly and IC testing is a plus
• Ability to collaborate and work across different functional teams and different sites
• Self-driven and can work independently

ACADEMIC CREDENTIALS

• Master’s degree is preferred
• > 7 years relevant experience preferred

LOCATION:

Singapore

#LI-SP2