WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

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Job Role and Responsibility: AMD, Inc. is hiring Sr. Packaging Engineers to research, design, develop, and/or test electronic components and systems for semiconductor and related device manufacturing, employing knowledge of electronic theory. Manage package development program from concept development to high volume production for next generation CPU products. Develop design guidelines and assembly process techniques for advanced electronic packaging. Create, conduct, and analyze Design of Experiments (DOE) for development and sustaining activities. Utilize hands-on expertise of assembly processes for flip chip package development. Coordinate with suppliers, process engineers and contract manufacturers to define the process flow and ensure manufacturability. Perform package design and construction feasibility studies to define new package concepts based on product requirements. Research and develop substrate materials and manufacturing techniques, electronic packaging materials, assembly Processes, multi die stacking and 2.5D/3D package technologies. Solve technical issues on package reliability, materials, and assembly process. Work cross-functionally to understand trade-offs, constraints for optimizing package cost & performance. Represent packaging team in all relevant forums to ensure on time flawless NPI.

Multiple openings.  Qualified applicants click “APPLY NOW” button to apply online.

Travel required: NO         

Qualifications: Degree required

Master’s degree or foreign equivalent in Computer Engineering, Electrical Engineering, Electronic Engineering, Mechanical Engineering, or related field.

Qualifications: Amount and type of experience required: Two (2) years of experience in job offered or closely related engineering role.

Specific skills required: The following skills are required:

Position requires experience in the following:

• CAD tools;
• Product development cycles;
• JMP/SPC (Statistical Process Control) Analysis;
• Microelectronics package assembly;
• C or C++; and
• ANSYS.

Experience may be gained through graduate-level coursework, research, or internship experience.

#LI-DP1

At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Job Role and Responsibility: AMD, Inc. is hiring Sr. Packaging Engineers to research, design, develop, and/or test electronic components and systems for semiconductor and related device manufacturing, employing knowledge of electronic theory. Manage package development program from concept development to high volume production for next generation CPU products. Develop design guidelines and assembly process techniques for advanced electronic packaging. Create, conduct, and analyze Design of Experiments (DOE) for development and sustaining activities. Utilize hands-on expertise of assembly processes for flip chip package development. Coordinate with suppliers, process engineers and contract manufacturers to define the process flow and ensure manufacturability. Perform package design and construction feasibility studies to define new package concepts based on product requirements. Research and develop substrate materials and manufacturing techniques, electronic packaging materials, assembly Processes, multi die stacking and 2.5D/3D package technologies. Solve technical issues on package reliability, materials, and assembly process. Work cross-functionally to understand trade-offs, constraints for optimizing package cost & performance. Represent packaging team in all relevant forums to ensure on time flawless NPI.

Multiple openings.  Qualified applicants click “APPLY NOW” button to apply online.

Travel required: NO         

Qualifications: Degree required

Master’s degree or foreign equivalent in Computer Engineering, Electrical Engineering, Electronic Engineering, Mechanical Engineering, or related field.

Qualifications: Amount and type of experience required: Two (2) years of experience in job offered or closely related engineering role.

Specific skills required: The following skills are required:

Position requires experience in the following:

• CAD tools;
• Product development cycles;
• JMP/SPC (Statistical Process Control) Analysis;
• Microelectronics package assembly;
• C or C++; and
• ANSYS.

Experience may be gained through graduate-level coursework, research, or internship experience.

#LI-DP1