Sr. Packaging Engineer
What you do at AMD changes everything
At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center.
Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
Perform research and development activities in AMD’s advance electronic packaging development team; identify, develop, and productize cutting edge advanced packaging solutions for AMD products; characterize polymeric materials involved in electronic chip packaging; perform numerical modelling of polymer structures to optimize AMD’s novel and leading edge packaging for advanced electronic systems and computer/graphics processors; utilize advanced packaging techniques including fan-out, 3D stacking, and 2.5D packaging techniques for improved functionality; partner with AMD architects, designers, and product owners to develop high-yield, cost–effective packaging materials solutions to meet product requirements; work with suppliers to scope, develop, and demonstrate new packaging technology materials and processes; partner with product teams and manufacturing engineering to demonstrate reliability of packaging schemas and smoothly transition new packaging technologies from concept through NPI; and publish patents and technical papers related to the modelling of electronic packaging.
Master’s degree (or foreign equivalent) in materials science, computer science, computational physics, computer engineering, or a closely related degree.
Amount and type of experience required:
12 months of experience in the job offered or closely related engineering role, or as an Intern or Graduate Research Assistant.
Position requires education or experience with the following technologies and/or skills: CAD tools (AutoCAD, SolidWorks), Python, Matlab, flip-chip bonding: pick and place with mass reflow assembly process, thermocompression bonding, solder paste printing, finite element modeling, Scanning Electron Microscopy (SEM), Energy Dispersive X-Ray Spectroscopy (EDX), X-Ray Photoelectron Spectroscopy (XPS), Differential Scanning Calorimetry (DSC), X-Ray Diffraction (XRD), C-mode scanning acoustic microcopy (CSAM), Shadow Moire warpage technique, reliability testing and failure analysis in semiconductor packages, electroless metal deposition, electrolytic metal deposition, physical vapor deposition (sputtering), plasma reactive ion etching (RIE), thin film lamination, lithography, and goniometry.
Skills may be gained concurrently. Employer will accept skills gained in furtherance of university degree via coursework, projects, internships, research, theses, etc.
Requisition Number: 171942
Country: United States State: Texas City: Austin
Job Function: Packaging Engineering
Benefits offered are described here.
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