WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_

THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip Assembly/Bumping manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.  

THE PERSON:

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good presentation skills. Good in writing and speaking in English. Last but not least, be able to cope with stress!

KEY RESPONSIBILITIES:

• Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
• Co-work with AMD internal stakeholders on new product development in external manufacturing facility of bumping and assembly (Flip Chip and Advanced Packaging). Proactively communicate task assignments to responsible parties and ensure that tasks are completed within the planned time. Proactively report project status to stakeholders.
• Drive assembly and bumping process baseline standardization and continuous improvement.
• Plan and drive for New Product Introduction activities and Ramp Up readiness.
• Responsible for packaging yield, quality, cost and operation productivity improvements and sustaining activities.
• Drive external manufacturer on issue resolution and issue prevention
• Monitor performance of external manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
• Plan and execute change management from internal or external parties.
• Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
• Provide disposition to out-of-control lots and present for Material Review Board (MRB).
• Assist in additional duties as deemed fit by supervisor.

PREFERRED EXPERIENCE:

• Strong knowledge in Assembly Flip chip & Advanced Packaging experience in InFO or 2.5D/3D Bump/TSV/Packaging or WLFO process engineering and Bumping process engineering.

• Track record of development work leading to volume production in Semiconductor Bumping/ Assembly house.

• Possess Chip-Packaging Interaction knowledge.

• Strategic supplier management experience.
• Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

ACADEMIC CREDENTIALS:

• Bachelor/MS degree in Mechanical or Material or Chemical Engineering

LOCATION:

Penang

#LI-HS

#LI-Hybrid

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip Assembly/Bumping manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.  

THE PERSON:

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good presentation skills. Good in writing and speaking in English. Last but not least, be able to cope with stress!

KEY RESPONSIBILITIES:

• Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
• Co-work with AMD internal stakeholders on new product development in external manufacturing facility of bumping and assembly (Flip Chip and Advanced Packaging). Proactively communicate task assignments to responsible parties and ensure that tasks are completed within the planned time. Proactively report project status to stakeholders.
• Drive assembly and bumping process baseline standardization and continuous improvement.
• Plan and drive for New Product Introduction activities and Ramp Up readiness.
• Responsible for packaging yield, quality, cost and operation productivity improvements and sustaining activities.
• Drive external manufacturer on issue resolution and issue prevention
• Monitor performance of external manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
• Plan and execute change management from internal or external parties.
• Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
• Provide disposition to out-of-control lots and present for Material Review Board (MRB).
• Assist in additional duties as deemed fit by supervisor.

PREFERRED EXPERIENCE:

• Strong knowledge in Assembly Flip chip & Advanced Packaging experience in InFO or 2.5D/3D Bump/TSV/Packaging or WLFO process engineering and Bumping process engineering.

• Track record of development work leading to volume production in Semiconductor Bumping/ Assembly house.

• Possess Chip-Packaging Interaction knowledge.

• Strategic supplier management experience.
• Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

ACADEMIC CREDENTIALS:

• Bachelor/MS degree in Mechanical or Material or Chemical Engineering

LOCATION:

Penang

#LI-HS

#LI-Hybrid