WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

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Fellow Packaging Engineering-Data Center GPU

THE TEAM:

AMD's Data Center GPU organization is transforming the industry with our AI based Graphic Processors. Our primary objective is to design exceptional products that drive the evolution of computing experiences, serving as the cornerstone for enterprise Data Centers, (AI) Artificial Intelligence, HPC and Embedded systems. If this resonates with you, come and joining our Data Center GPU organization where we are building amazing AI powered products with amazing people.

THE ROLE:
AMD Data Center division is looking for a talented and energetic Fellow Packaging engineer to add to the existing skills of our engineering team. The suitable candidate will be working on our Data Center products. In this role, you will deliver quality, High Speed Package/PCB Ball Out Designs, you will be responsible for driving the development of ASIC ball out, planning and execution. Responsibilities also include helping Packaging, SI and PCB engineering teams meet high-speed designs for mass volume manufacturing.

THE PERSON:
AMD Data Center division needs a Fellow Packaging engineer who will be responsible for designing cutting-edge package ball out designs, which is essential to our company’s future! A successful candidate will have the drive to create next-generation package ball out designs and help craft the future of package ball out designs at AMD; a strong background in package ball out design and understanding of both package and PCB manufacturing is critical for this role. Planning and execution of ASIC development from concept to complete product.

KEY RESPONSIBILITIES: 

• Package ball out designs
• High-Speed PCB Design development
• Package ball out optimization
• Develop routing strategies for new IP including, PCIe, DP, Memory, XGMI, Stackup creation, and high-speed Package/PCB optimization.
• Strategizing with a variety of teams including, SI, EMI, PI, Thermal and Mechanical Development of Design rules
• Aiding in the development of New Tools and Processes Developing ASIC ball-outs
• Experience in memory, HDI, power technologies
• Support quality objectives of the company

PREFERRED EXPERIENCE:

• Proven track record of successful package ball out designs
• Strong skills in Cadence Allegro/ 17.x and packaging design suite In-depth knowledge of Allegro Constraint Manager High-Speed signals in high-density designs with Impedance control
  package and PCB Stack up creation
• High-Speed material selection Experience with utilities written in Skill
• Strong understanding of Package and PCB manufacturing processes
• Good interpersonal skills
• Secondary experience:
• Skill Language scripting
• Pearl, C, C++ or similar for script development Valor and Valor ERF development
• PCB Footprint development and schematic symbol creation

ACADEMIC CREDENTIALS:

• Bachelor's degree in electrical engineering/computer engineering 
  
• Master's degree in electrical engineering/computer engineering preferred.

LOCATION:

• Santa Clara, California

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At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

At AMD, your base pay is one part of your total rewards package.  Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Fellow Packaging Engineering-Data Center GPU

THE TEAM:

AMD's Data Center GPU organization is transforming the industry with our AI based Graphic Processors. Our primary objective is to design exceptional products that drive the evolution of computing experiences, serving as the cornerstone for enterprise Data Centers, (AI) Artificial Intelligence, HPC and Embedded systems. If this resonates with you, come and joining our Data Center GPU organization where we are building amazing AI powered products with amazing people.

THE ROLE:
AMD Data Center division is looking for a talented and energetic Fellow Packaging engineer to add to the existing skills of our engineering team. The suitable candidate will be working on our Data Center products. In this role, you will deliver quality, High Speed Package/PCB Ball Out Designs, you will be responsible for driving the development of ASIC ball out, planning and execution. Responsibilities also include helping Packaging, SI and PCB engineering teams meet high-speed designs for mass volume manufacturing.

THE PERSON:
AMD Data Center division needs a Fellow Packaging engineer who will be responsible for designing cutting-edge package ball out designs, which is essential to our company’s future! A successful candidate will have the drive to create next-generation package ball out designs and help craft the future of package ball out designs at AMD; a strong background in package ball out design and understanding of both package and PCB manufacturing is critical for this role. Planning and execution of ASIC development from concept to complete product.

KEY RESPONSIBILITIES: 

• Package ball out designs
• High-Speed PCB Design development
• Package ball out optimization
• Develop routing strategies for new IP including, PCIe, DP, Memory, XGMI, Stackup creation, and high-speed Package/PCB optimization.
• Strategizing with a variety of teams including, SI, EMI, PI, Thermal and Mechanical Development of Design rules
• Aiding in the development of New Tools and Processes Developing ASIC ball-outs
• Experience in memory, HDI, power technologies
• Support quality objectives of the company

PREFERRED EXPERIENCE:

• Proven track record of successful package ball out designs
• Strong skills in Cadence Allegro/ 17.x and packaging design suite In-depth knowledge of Allegro Constraint Manager High-Speed signals in high-density designs with Impedance control
  package and PCB Stack up creation
• High-Speed material selection Experience with utilities written in Skill
• Strong understanding of Package and PCB manufacturing processes
• Good interpersonal skills
• Secondary experience:
• Skill Language scripting
• Pearl, C, C++ or similar for script development Valor and Valor ERF development
• PCB Footprint development and schematic symbol creation

ACADEMIC CREDENTIALS:

• Bachelor's degree in electrical engineering/computer engineering 
  
• Master's degree in electrical engineering/computer engineering preferred.

LOCATION:

• Santa Clara, California

#LI-EV1

#LI-HYBRID