MTS Packaging Engineer

May 14, 2024
Singapore, Singapore
... Not specified
... Intermediate
Full time
... Office work


WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_




THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement with external manufacturer/material suppliers on delivering key performance indices in terms on Value Engineering and Enabling new capabilities.  

 

THE PERSON:

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills. Be creative and think out of box to challenge current process / design, provide constructive and objective idea with cost and efficiency improvement.

 

KEY RESPONSIBILITIES:

  • Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio.
  • Organize and lead on cost initiative via Value Analysis Value Engineering (VAVE) to ensure cost saving realize on time and well tracked with close collaboration with external manufacturers/ material suppliers and internal stakeholders.
  • Plan and execute systematically from conceptualization, feasibility study to implementation with end-to-end coverage.
  • Prepare & present Executive Summary of projects.
  • Overseas travelling as required.
  • Assist in additional duties as deemed fit by supervisor.

 

PREFERRED EXPERIENCE:

  • Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing, Assembly manufacturing, is added advantage)
  • Track record of development work leading to volume production in Semiconductor manufacturing.
  • Good leadership and interpersonal relationship.
  • Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges, power BI) and industry standard (ESD, Jedec, Automotive)
  • Wafer level fan-out (WLFO) and Elevated Fanout Bridge (EFB) knowledge is an added advantage

ACADEMIC CREDENTIALS:

  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering
  • 8 years of working experience in Backend Semiconductor.

LOCATION:

Singapore

 

#LI-LL1




Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement with external manufacturer/material suppliers on delivering key performance indices in terms on Value Engineering and Enabling new capabilities.  

 

THE PERSON:

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills. Be creative and think out of box to challenge current process / design, provide constructive and objective idea with cost and efficiency improvement.

 

KEY RESPONSIBILITIES:

  • Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio.
  • Organize and lead on cost initiative via Value Analysis Value Engineering (VAVE) to ensure cost saving realize on time and well tracked with close collaboration with external manufacturers/ material suppliers and internal stakeholders.
  • Plan and execute systematically from conceptualization, feasibility study to implementation with end-to-end coverage.
  • Prepare & present Executive Summary of projects.
  • Overseas travelling as required.
  • Assist in additional duties as deemed fit by supervisor.

 

PREFERRED EXPERIENCE:

  • Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing, Assembly manufacturing, is added advantage)
  • Track record of development work leading to volume production in Semiconductor manufacturing.
  • Good leadership and interpersonal relationship.
  • Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges, power BI) and industry standard (ESD, Jedec, Automotive)
  • Wafer level fan-out (WLFO) and Elevated Fanout Bridge (EFB) knowledge is an added advantage

ACADEMIC CREDENTIALS:

  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering
  • 8 years of working experience in Backend Semiconductor.

LOCATION:

Singapore

 

#LI-LL1

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