WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_

THE ROLE:   

We are looking for an Embedded Product Applications Engineer (PAE) to provide technical support for Xilinx FPGAs (Field Programmable Gate Arrays), SoCs (System on a Chip), and ACAPs (Adaptive Compute Acceleration Platform) as well as the associated Xilinx tools, software drivers, and IP (Intellectual Property). The PAE works with customers, field engineers, technical marketing, and factory engineers in a worldwide team to rapidly resolve complex technical issues. The PAE enables customers to complete their designs and recommends improvements to AMD products. The environment is fast moving with a focus on emerging technologies.  

THE PERSON:   

As a PAE you will deliver EPYC application support to our growing customer base for the next generation of products AMD (Advanced Micro Devices) is producing. Your expertise will be necessary to analyze HSIO design risk, develop solutions, assess root causes, and produce solution resolutions.  

KEY RESPONSIBILITIES:   

• Provide direct technical support to customers on critical design issues 
• Collaborate with cross functional team members to identify customer problems 
• Advise customers on design techniques and the implementation of alternative solutions  
• Generate self-support materials including application notes, white paper, and answer records 

• Analyze customer cases and use data to influence product improvements. 
• Working with customers and internal design teams to evaluate design tradeoffs and optimize design performance/ risk/ cost/ manufacturability
• Performing HSIO simulation risk assessment including DDR, PCIe, XGMI, USB, SATA, etc.
• Simulation collateral development, qualification, and validation 
• Analyzing and reviewing cusotmer HSIO design
• Driving next generation design specification
• Driving simulation flow enhancements and automation - improving performance and efficiency
• Test fixture development

PREFERRED EXPERIENCE:   

• Familiar with server architecture, HSIO design, and SERDES/DDR5 simulation and validation
• Familiar with time domain and frequency domain simulation tools such as: HFSS, SIWAVE, ADS, Seasim, and S2eye
• Excellent knowledge of HSIO board design such as DDR, PCIe/CLK, XGMI, USB, and SATA
• Experience S-parameter analysis and VNA/PNA measurement
• Experience driving a project to completion, documenting design, actions, and meeting minutes
• Strong communication and documentation skills including skills to manage without authority
• Team player. Be able to share knowledge, learn from others, and support other groups within an organization

• Outstanding oral and written communication skills  

• Good organizational skills with the ability to multitask, prioritize, and track many activities 
• Python programming skill for data analytics is a plus.
• Ansys AEDT automation programming skill is a plus.
• Understanding PNA/VNA PCB de-embedded methods is a plus.

ACADEMIC CREDENTIALS:   

•   Master's or PhD in Physics, Communications Engineering, and Electronic Engineering. Or relevant industry experience in signal integrity

#LI-SC1

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE:   

We are looking for an Embedded Product Applications Engineer (PAE) to provide technical support for Xilinx FPGAs (Field Programmable Gate Arrays), SoCs (System on a Chip), and ACAPs (Adaptive Compute Acceleration Platform) as well as the associated Xilinx tools, software drivers, and IP (Intellectual Property). The PAE works with customers, field engineers, technical marketing, and factory engineers in a worldwide team to rapidly resolve complex technical issues. The PAE enables customers to complete their designs and recommends improvements to AMD products. The environment is fast moving with a focus on emerging technologies.  

THE PERSON:   

As a PAE you will deliver EPYC application support to our growing customer base for the next generation of products AMD (Advanced Micro Devices) is producing. Your expertise will be necessary to analyze HSIO design risk, develop solutions, assess root causes, and produce solution resolutions.  

KEY RESPONSIBILITIES:   

• Provide direct technical support to customers on critical design issues 
• Collaborate with cross functional team members to identify customer problems 
• Advise customers on design techniques and the implementation of alternative solutions  
• Generate self-support materials including application notes, white paper, and answer records 

• Analyze customer cases and use data to influence product improvements. 
• Working with customers and internal design teams to evaluate design tradeoffs and optimize design performance/ risk/ cost/ manufacturability
• Performing HSIO simulation risk assessment including DDR, PCIe, XGMI, USB, SATA, etc.
• Simulation collateral development, qualification, and validation 
• Analyzing and reviewing cusotmer HSIO design
• Driving next generation design specification
• Driving simulation flow enhancements and automation - improving performance and efficiency
• Test fixture development

PREFERRED EXPERIENCE:   

• Familiar with server architecture, HSIO design, and SERDES/DDR5 simulation and validation
• Familiar with time domain and frequency domain simulation tools such as: HFSS, SIWAVE, ADS, Seasim, and S2eye
• Excellent knowledge of HSIO board design such as DDR, PCIe/CLK, XGMI, USB, and SATA
• Experience S-parameter analysis and VNA/PNA measurement
• Experience driving a project to completion, documenting design, actions, and meeting minutes
• Strong communication and documentation skills including skills to manage without authority
• Team player. Be able to share knowledge, learn from others, and support other groups within an organization

• Outstanding oral and written communication skills  

• Good organizational skills with the ability to multitask, prioritize, and track many activities 
• Python programming skill for data analytics is a plus.
• Ansys AEDT automation programming skill is a plus.
• Understanding PNA/VNA PCB de-embedded methods is a plus.

ACADEMIC CREDENTIALS:   

•   Master's or PhD in Physics, Communications Engineering, and Electronic Engineering. Or relevant industry experience in signal integrity

#LI-SC1